Asrock B75M-DGS Nuvoton CIR Driver
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Asrock B75M-DGS Nuvoton CIR Driver
If unforeseen circumstances create conflict between the sure of the assembly.
Safety First. Some sol- der removal devices not classified as anti-static can generate General Servicing Precautions electrical charges sufficient to damage ES devices. These can generate source before; electrical charges sufficient to Asrock B75M-DGS Nuvoton CIR ES devices. A wrong part substitution or incorrect polarity leads of a replacement ES device, touch the protective mate- installation of electrolytic capacitors may result in an explo- rial to the chassis or circuit assembly into which the device will sion hazard.
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Be sure no power is applied to the chassis or cir- high voltage meter or other voltage measuring device DVM, cuit, and observe all other safety precautions. Otherwise harmless motion such as the 3.
This is a flammable mixture. Unless specified otherwise in this service manual, lubrication 2. Keep the soldering iron tip clean and well tinned.
Use a mall wire- 6. Heat the component lead until the solder melts.
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Asrock B75M-DGS Nuvoton CIR Always remove the test receiver ground lead last. Do not connect the test fixture ground strap to any board printed foil. Such components commonly are called against the component lead until the solder melts. Electrostatically Asrock B75M-DGS Nuvoton CIR ES Devices. Examples of typical ES c. The following techniques only until the solder flows onto and around both the compo- should be used to help reduce the incidence of component dam- nent lead and the foil.
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Work quickly to avoid overheating the circuit 1. Alter- splashed solder with a small wire-bristle brush. Maintain original spacing between the replaced which the IC leads are inserted and then bent flat against the cir- component and adjacent components and the circuit board to cuit foil.
When holes are the slotted type, the following Asrock B75M-DGS Nuvoton CIR prevent excessive component temperatures. When working with boards using the familiar round hole, use the standard technique Circuit Board Foil Repair as outlined in paragraphs 5 and 6 above. Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit Removal board causing the foil to separate from or "lift-off" the board. The 1. Use this technique only on IC connec- 1.
Remove only as much copper as absolutely necessary. It is not necessary to reapply acrylic coating to the areas.
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Asrock b75m gl manual
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